Package design
Package and board layout, SI/PI, thermal, and mechanical design.
Silitronics
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About Silitronics
Design, fabrication, dicing, and assembly services support semiconductor and photonics packaging projects. Work includes package and board layout, signal and power integrity, thermal and mechanical design, and build-up or ceramic substrate fabrication. Wafer services include thinning, polishing, dicing, stealth laser processing, and automated optical inspection of photonic integrated circuits. Silicon photonics offerings include active alignment of fiber array units, edge coupling, and beam characterization. Assembly includes flip-chip placement, while chiplet services cover floor planning, optimization, and heterogeneous integration. The company also describes multi-chiplet system-in-package solutions for lidar and optical packaging for high-speed data applications. Silitronics is based in San Jose, California.
Disclosure: Profile information has been compiled from publicly available sources and has not yet been verified by the business.
Representative photos. Illustrative images for this category, not photos of Silitronics and not provided by the business.
Highlights
Wafer processing
Wafer thinning, polishing, dicing, and optical inspection.
Photonics assembly
Active alignment, edge coupling, and heterogeneous integration.
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